NY2170H基板典型性能 Typical Properties for NY2170H Laminate
| 屬性 Property | 項目 Item | 測試方法 IPC-TM-650 | 測試條件 Test Condition | 單位 Unit | 典型值 Typical Value | |
| 熱性能 Thermal | 玻璃態轉換溫度 Tg Glass Transition Temperature | 2.4.25 | DSC | ℃ | \ | |
| 2.4.24 | TMA | ℃ | 170 | |||
| 2.4.24.4 | DMA | ℃ | 240 | |||
| X/Y軸熱膨脹系數 X/Y-axis CTE | 2.4.24.5 | ＜Tg,TMA | PPM/℃ | 13\14 | ||
| Z軸熱膨脹系數 Z-axis CTE | 2.4.24 | ＜Tg,TMA | PPM/℃ | 35 | ||
| ＞Tg,TMA | PPM/℃ | 170 | ||||
| 2.4.24 | 50~260℃ | % | 1.8 | |||
| 熱分解溫度 Td Decomposition Temperature | 2.4.24.6 | TGA(5%W.L) | ℃ | 350 | ||
| 耐熱性 T288 Thermal Resistance | 2.4.24.1 | Clad | Min | 35 | ||
| Etched | Min | 50 | ||||
| 電性能 Electrical | 介電常數 Dk (R/C:55%/70%) Permittivity | 1MHz | 2.5.5.9 | C-24/23/50 | — | 4.50\4.05 |
| 1GHz | 4.45\4.00 | |||||
| 10GHz | SPDR method | \ | ||||
| 介質損耗 Df (R/C:55%/70%) Loss Tangent | 1MHz | 2.5.5.9 | C-24/23/50 | — | 0.0156\0.0167 | |
| 1GHz | — | 0.0167\0.0179 | ||||
| 10GHz | SPDR method | \ | ||||
| 體積電阻 Volume Resistivity | 2.5.17.1 | C-96/35/90 | MΩ-cm | 2.8×108 | ||
| 表面電阻 Surface Resistivity | MΩ | 2.5×107 | ||||
| 物理性能 Physical | 吸水率 Water Absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.08 | |
| 剝離強度 (HTE) Peel Strength | 1oz | 2.4.8 | As Received | N/mm | 1.0 | |
| 剝離強度(RTF) Peel Strength | 1oz | |||||
| 剝離強度(HVLP) Peel Strength | 1oz | \ | ||||
| 彎曲強度 Flexural Strength | Warp | 2.4.4 | As Received | N/mm2 | 580 | |
| Fill | 460 | |||||
| 耐燃性 Flame Resistance | UL-94 | A&E-4/125 | — | V-0 | ||
準備好推動創新以實現您的成功了嗎？
我們致力于承載科技創新的巨大能量，為全球客戶提供高效、可持續的CCL全系列解決方案。
