Low CTE& Normal Tg & Lead Free Compatible NY2140/NY2140P
| 屬性 Property | 項目 Item | 測試方法 IPC-TM-650 | 測試條件 Test Condition | 單位 Unit | 典型值 Typical Value | |
| 熱性能 Thermal | 玻璃態轉換溫度 Tg Glass Transition Temperature | 2.4.25 | DSC | ℃ | 140 | |
| 2.4.24 | TMA | ℃ | \ | |||
| 2.4.24.4 | DMA | ℃ | \ | |||
| X/Y軸熱膨脹系數 X/Y-axis CTE | 2.4.24.5 | <Tg,TMA | PPM/℃ | 13\14 | ||
| Z軸熱膨脹系數 Z-axis CTE | 2.4.24 | <Tg,TMA | PPM/℃ | 50 | ||
| >Tg,TMA | PPM/℃ | 260 | ||||
| 2.4.24 | 50~260℃ | % | 3.5 | |||
| 熱分解溫度 Td Decomposition Temperature | 2.4.24.6 | TGA(5%W.L) | ℃ | 350 | ||
| 耐熱性 T288 Thermal Resistance | 2.4.24.1 | Clad | Min | 15 | ||
| Etched | Min | 30 | ||||
| 電性能 Electrical | 介電常數 Dk (R/C:55%/70%) Permittivity | 1MHz | 2.5.5.9 | C-24/23/50 | — | 4.20\3.80 |
| 1GHz | 4.15\3.70 | |||||
| 10GHz | SPDR method | \ | ||||
| 介質損耗 Df (R/C:55%/70%) Loss Tangent | 1MHz | 2.5.5.9 | C-24/23/50 | — | 0.0155\0.0166 | |
| 1GHz | — | 0.0166\0.0178 | ||||
| 10GHz | SPDR method | \ | ||||
| 體積電阻 Volume Resistivity | 2.5.17.1 | C-96/35/90 | MΩ-cm | 5.5×108 | ||
| 表面電阻 Surface Resistivity | MΩ | 3.0×107 | ||||
| 物理性能 Physical | 吸水率 Water Absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.12 | |
| 剝離強度 (HTE) Peel Strength | 1oz | 2.4.8 | As Received | N/mm | 1.42 | |
| 剝離強度(RTF) Peel Strength | 1oz | \ | ||||
| 剝離強度(HVLP) Peel Strength | 1oz | \ | ||||
| 彎曲強度 Flexural Strength | Warp | 2.4.4 | As Received | N/mm2 | 515 | |
| Fill | 405 | |||||
| 耐燃性 Flame Resistance | UL-94 | A&E-4/125 | — | V-0 | ||
準備好推動創新以實現您的成功了嗎?
我們致力于承載科技創新的巨大能量,為全球客戶提供高效、可持續的CCL全系列解決方案。