NY2150/NY2150P
Tg155℃ Lead-free Compatible
Excellent Peel Strength
Low Z-axis CTE
Low Water Absorption
Excellent Anti-CAF Performance
Excellent Dimension Stability
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Automotive -
Consumer Electronics -
Instrumentations -
Communications
Typical Properties for NY2150 Laminate
| 屬性 Property | 項(xiàng)目 Item | 測(cè)試方法 IPC-TM-650 | 測(cè)試條件 Test Condition | 單位 Unit | 典型值 Typical Value | |
| 熱性能 Thermal | 玻璃態(tài)轉(zhuǎn)換溫度 Tg Glass Transition Temperature | 2.4.25 | DSC | ℃ | 155 | |
| 2.4.24 | TMA | ℃ | 145 | |||
| 2.4.24.4 | DMA | ℃ | \ | |||
| X/Y軸熱膨脹系數(shù) X/Y-axis CTE | 2.4.24.5 | ＜Tg,TMA | ppm/°C | 13\14 | ||
| Z軸熱膨脹系數(shù) Z-axis CTE | 2.4.24 | ＜Tg,TMA | ppm/°C | 40 | ||
| ＞Tg,TMA | ppm/°C | 245 | ||||
| 2.4.24 | 50~260℃ | % | 3 | |||
| 熱分解溫度 Td Decomposition Temperature | 2.4.24.6 | TGA(5%W.L) | ℃ | 350 | ||
| 耐熱性 T288 Thermal Resistance | 2.4.24.1 | Clad | Min | 30 | ||
| Etched | Min | 30 | ||||
| 電性能 Electrical | 介電常數(shù) Dk (R/C:55%/70%) Permittivity | 1MHz | 2.5.5.9 | C-24/23/50 | — | 4.30\3.90 |
| 1GHz | 4.25\3.85 | |||||
| 10GHz | SPDR method | \ | ||||
| 介質(zhì)損耗 Df (R/C:55%/70%) Loss Tangent | 1MHz | 0.0147\0.0158 | ||||
| 1GHz | — | 0.0158\0.0170 | ||||
| 10GHz | SPDR method | \ | ||||
| 體積電阻 Volume Resistivity | 2.5.17.1 | C-96/35/90 | MΩ-cm | 6.0×108 | ||
| 表面電阻 Surface Resistivity | MΩ | 3.3×107 | ||||
| 物理性能 Physical | 吸水率 Water Absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.12 | |
| 剝離強(qiáng)度 (HTE) Peel Strength | 1oz | 2.4.8 | As Received | N/mm | 1.39 | |
| 剝離強(qiáng)度(RTF) Peel Strength | 1oz | \ | ||||
| 剝離強(qiáng)度(HVLP) Peel Strength | 1oz | \ | ||||
| 彎曲強(qiáng)度 Flexural Strength | Warp | 2.4.4 | As Received | N/mm2 | 515 | |
| Fill | 405 | |||||
| 耐燃性 Flame Resistance | UL-94 | A&E-4/125 | — | V-0 | ||
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