NY3176HF /NY3176HFP
Mid-Tg Halogen-free and Lead-free Compatible
Low Z-axis CTE
Excellent Anti-CAF Performance
Excellent Dimension Stability
-
Tablet -
Notebook -
HDD/SSD -
Smart Phone -
Memory Module -
Wearable Device
Typical Properties for NY3176HF Laminate
| 屬性 Property | 項(xiàng)目 Item | 測(cè)試方法 IPC-TM-650 | 測(cè)試條件 Test Condition | 單位 Unit | 典型值 Typical Value | |
| 熱性能 Thermal | 玻璃態(tài)轉(zhuǎn)換溫度 Tg Glass Transition Temperature | 2.4.25 | DSC | ℃ | / | |
| 2.4.24 | TMA | ℃ | 150 | |||
| 2.4.24.4 | DMA | ℃ | 190 | |||
| Z軸熱膨脹系數(shù) Z-axis CTE | 2.4.24 | ＜Tg,TMA | ppm/°C | 35 | ||
| ＞Tg,TMA | ppm/°C | 215 | ||||
| 2.4.24 | 50~260℃ | % | 2.8 | |||
| 熱分解溫度 Td Decomposition Temperature | 2.4.24.6 | TGA(5%W.L) | ℃ | 380 | ||
| 耐熱性 T288 Thermal Resistance | 2.4.24.1 | Clad | Min | ＞60 | ||
| Etched | Min | ＞60 | ||||
| 電性能 Electrical | 介電常數(shù) Dk (R/C:55%/70%) Permittivity | 1GHz | 2.5.5.9 | C-24/23/50 | — | 4.8\4.4 |
| 10GHz | SPDR method | — | 4.3\4.0 | |||
| 介質(zhì)損耗 Df (R/C:55%/70%) Loss Tangent | 1GHz | 2.5.5.9 | C-24/23/50 | — | 0.009\0.011 | |
| — | ||||||
| 10GHz | SPDR method | 0.011\0.013 | ||||
| 體積電阻 Volume Resistivity | 2.5.17.1 | C-96/35/90 | MΩ-cm | 1.5×108 | ||
| 表面電阻 Surface Resistivity | MΩ | 2.0×107 | ||||
| 物理性能 Physical | 吸水率 Water Absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.11 | |
| 剝離強(qiáng)度 (HTE) Peel Strength | 1oz | 2.4.8 | As Received | N/mm | 1.2 | |
| 耐燃性 Flame Resistance | UL-94 | A&E-4/125 | — | V-0 | ||
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